Cornell researchers have used high-resolution 3D imaging to detect, for the first time, the atomic-scale defects in computer chips that can sabotage their performance. The imaging method, which was the result of a collaboration with Taiwan Semiconductor Manufacturing Company (TSMC) and Advanced Semiconductor Materials (ASM), could touch almost every form of modern electronics, from phones and automobiles to AI data centers and quantum computing.
Electron microscopy shows ‘mouse bite’ defects in semiconductors
